Electronic module with conductively heat-sunk components

摘要

A heat transfer arrangement for one or more heat-generating components (18a) on a printed-circuit board (16) includes a heat transfer plate (316) defining an aperture (416) registered with the components. A "vertically" movable heatsink adapter (410) is adjusted to juxtapose its "lower" surface with the "upper" surface of the components to be heat-sunk. A heat-transfer pad (318) may be used between the heatsink adapter (410) and the component (18a). In various embodiments, the heatsink adapter takes the form of circular (410) or rectangular (410R) plugs, a draw-tube (808) arrangement, or a bellows (1010).