发明名称 COMPOSITE GOLD PLATING FILM, ITS PRODUCTION AND ELECTRICAL CONTACT HAVING THE COMPOSITE GOLD PLATING FILM
摘要 PROBLEM TO BE SOLVED: To prepare a film hardly sticking stain, and capable of easily removing the stain even if it is stuck to the film and keeping low contact electrical resistance and excellent wear resistance by subjecting a film to heat treatment at a specified temp. SOLUTION: This composite gold plating film 1 is formed in such a manner that an electrical contact 2 whose upper face is provided with a primary coat 3 for improving the adhesion with gold or a fluorine series high polymer compd. is subjected to plating treatment, and gold 6a and high polymer fluororesin compd. fine particles 6c are co-deposited. As for the electrical contact 2 having the composite gold plating film 1, by executing heat treatment at 220 to 360 deg.C, in this surface, water repellency of 100 to 140 degrees by the contact angle of water, specific resistance of 2.5 to 3.0×10<-6>Ω.cm and contact electrical resistance of 0.05 to 1.0Ωcan be realized. Thus, while the sticking of water and the other stains to the surface is prevented, the low contact electrical resistance characteristic of gold plating is attained, electrical hits are prevented, and stable electrical conductivity can be secured. Moreover, by the heat treatment, the mechanical strengto of the substrate 3 is improved.
申请公布号 JPH11335859(A) 申请公布日期 1999.12.07
申请号 JP19980144075 申请日期 1998.05.26
申请人 PROTONICS KENKYUSHO:KK 发明人 YUGAWA AKIHIRO
分类号 C23C18/44;C23C18/52;C25D15/02;H01H1/00;H01R13/03;(IPC1-7):C23C18/52 主分类号 C23C18/44
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