| 摘要 |
A semiconductor device packaged in a plastic package wherein the thickness of the plastic mold on the top surface of the semiconductor device chip is less than the height of the lead on the top surface of the semiconductor device chip and the top surface to the plastic mold filling the space between the leads is convex downward in an arc shape, and a metal mold employable for producing the semiconductor device packaged in a plastic package comprising a lower mold having a cavity in which a semiconductor device chip provided with a plurality of leads thereon, is placed during a molding process, and an upper mold having a lower surface having a plurality of longitudinal projections and recesses arranged in parallel to one anther, the cross section of the longitudinal projections and recesses produced along the lower surface of the upper mold being effective to cause longitudinal linear contact along the longitudinal projections and recesses, between the lower surface and the edges of the leads, during a molding process.
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