| 发明名称 |
Resin composition and semiconductor device employing the same |
| 摘要 |
A resin composition comprising (a) an epoxy compound, (b) a curing agent comprising a polysiloxane resin having a phenolic hydroxyl group on its side chain, and (c) an inorganic filler. The mixing ratio of the inorganic filler should preferably be 10 to 95% by weight based on the entire resin composition.
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| 申请公布号 |
US5998509(A) |
申请公布日期 |
1999.12.07 |
| 申请号 |
US19970980343 |
申请日期 |
1997.11.28 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HAYASE, RUMIKO;FUJIEDA, SHINETSU;HOTTA, YASUYUKI;MURAI, SHINJI |
| 分类号 |
C08G59/40;C08G77/16;C08L63/00;C08L83/04;H01L23/29;H01L23/31;(IPC1-7):C08K3/34;C08L63/02 |
主分类号 |
C08G59/40 |
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代理人 |
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