发明名称 MANUFACTURE OF PARTICLE BOARD
摘要 PROBLEM TO BE SOLVED: To enhance the bending strength even with a small quantity of resin and reduce a quantity of emitting formaldehyde by coating wood chips with the emulsion of a resol-type phenol resin having a specific average particle dia. as a binder, and making a particle board dense as specified. SOLUTION: The emulsion of a resol-type phenol resin is applied as a binder to wood chips. This emulsion is manufactured using phenols and aldehydes. Formaldehyde is especially used as the aldehydes, and the formaldehyde and the phenol when the emulsion is manufactured are in the molar ratio of about 0.8-2.2. In addition, the average particle dia. of the resol-type phenol resin is 0.3-5μm, and an application quantity to the wood chips is about 0.5-20 wt.% in terms of solid. Further, the density of the particle boards is 0.40-0.90 g/cm<3> . Consequently, moldings, which show a small quantity of emitted formaldehyde and also an outstanding bending strength and an outstanding bending strength when it is wet, can be manufactured.
申请公布号 JPH11333812(A) 申请公布日期 1999.12.07
申请号 JP19980144071 申请日期 1998.05.26
申请人 DAINIPPON INK & CHEM INC 发明人 OYA TOMOAKI
分类号 B27N3/02;(IPC1-7):B27N3/02 主分类号 B27N3/02
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