| 摘要 |
An aligning apparatus includes a first image pickup camera for picking up an image of an inspection contactor, a moving body located so as to be movable in X-, Y-, Z- and theta -directions and having the first image pickup camera fixed thereon, a wafer bearer capable of being located on the moving body and supporting a semiconductor wafer, a control circuit for controlling movements of the moving body moved in the individual directions, and a second image pickup camera for picking up an image of the semiconductor wafer on the bearer moving under the control of the control circuit. Positions for the first and second image pickup cameras to pick up the images are stored, the first image pickup camera picks up an image of the contact, the position of the contact is stored, the second image pickup camera picks up an image of an electrode of a chip corresponding to the contact, the position of the electrode is stored, and then the contact and the electrode are aligned with each other in accordance with the respective positions of the contact and the electrode.
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