发明名称 Surface acoustic wave devices and their manufacturing method
摘要 A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
申请公布号 US5998907(A) 申请公布日期 1999.12.07
申请号 US19980087079 申请日期 1998.05.29
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TAGUCHI, YUTAKA;EDA, KAZUO;KAWASAKI, OSAMU;TOMITA, YOSIHIRO;ONISHI, KEIJI;SEKI, SHUN-ICHI;NAMBA, AKIHIKO;SATO, HIROKI;OGURA, TETSUYOSI
分类号 H03H9/145;H03H9/02;H03H9/25;(IPC1-7):H03H9/64 主分类号 H03H9/145
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