发明名称 |
RESIN APPLIED CONDUCTIVE FOIL, LAMINATED SHEET USING THE SAME AND PRODUCTION OF THEM |
摘要 |
PROBLEM TO BE SOLVED: To achieve the convenience in the production of a laminated sheet by improving the handling properties of a resin applied conductive foil and to achieve the shortening of the period necessary for the production of the laminated sheet or to improve flatness. SOLUTION: An epoxy resin layer 5 is formed on one surface of a copper foil 1 and a PET film 4 is laminated to the rear surface thereof and an RCC 10 not generating the adhesion or cracking of the epoxy resin layer 5 even if both of them are laminated is obtained. Copper foils 2 are laminated to both upper and rear surfaces of a support plate 11 only at the peripheral parts thereof and the RCCs 10 are further laminated. The PET films 4 on both upper and rear surfaces are peeled and, thereafter, build-up or the lamination of preliminarily separately provided laminated sheets is performed to remove the peripheral adhered parts by cutting. By this constitution, a laminated sheet having flat surface conductive layers comprising the copper foils 2 is produced within a short producing time by a reduced number of processes. |
申请公布号 |
JPH11333975(A) |
申请公布日期 |
1999.12.07 |
申请号 |
JP19980144343 |
申请日期 |
1998.05.26 |
申请人 |
IBIDEN CO LTD |
发明人 |
OKUNISHI TATSUYA;MURAKI TETSUYA |
分类号 |
B32B15/08;H05K3/00;H05K3/46;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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