| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition exhibiting excellent mold releasability and having improved transparency and reliability against humidity even in case of repeated encapsulation by compounding an epoxy resin, a curing agent, a curing accelerator and a specific mold releasing agent. SOLUTION: With 100 pts.wt. of an epoxy resin containing at least two epoxy groups in the molecule are compounded a curing agent in an amount such that the equivalent ratio thereof to the epoxy resin is 0.5-5, preferably 0.7-1.3, a curing accelerator, 0.1-5 pts.wt. of a compound, as a mold releasing agent, represented by the formula I (wherein m is 1-30; and n is 1-50) or formula II (wherein r is 1-30; and s is 1-50) and having a wt. fraction of the portion having a structure of the formula: -OCH2 CH2 - of 40-90 wt.% and an average mol.wt. of 500-3,000 and, if required, inorganic fillers, discoloration inhibitors, antioxidants, flame retarders, colorants, modifiers, plasticizers, diluents and the like. The resulting compound is subjected to heating and kneading using a high speed agitator such as a homomixer or the like, a triple roll mill or the like followed by cooling, pulverizing and, if required, tableting. |
