| 摘要 |
The invention relates to a method for the packing of components (1) with conductor pins on a circuit board (2), in which method the component (1) is mounted on a daughter card, and to a daughter card module (10) thus formed. In the invention, the component (1) is connected to a first daughter card (3) by a conductor pin (6) on a first side of the component and to a second daughter card (4) by a conductor pin (5) on a second side of the component, thus forming a daughter card module (10). The daughter card module thus formed is connected by the daughter cards to a circuit board (2). The invention also relates to a cooling system for the cooling of components mounted between two daughter cards disposed at a distance from each other. The cooling system comprises a first cooling element (11) shaped to fit into a space formed between two components mounted between the two daughter cards. |
