发明名称
摘要 <p>PURPOSE:To obtain a paste of polyester imide-based resin suitable for overcoating material for screen printing, suppressing plate offset of paste, forming uniform thickness of film, having improved mechanical properties. CONSTITUTION:100 pts.wt. total amounts of (A) 5-70 pts.wt. low molecular weight polyimide precursor obtained by reacting an aromatic tetracarboxylic acid dianhydride (e.g. pyromellitic dianhydride) with an alcohol (e.g. methanol) to give an aromatic tetracarboxylic acid half ester and blending or reacting the half ester with an aromatic diamine (e.g. p-phenylenediamine) and (B) 95-30 pts.wt. heat-resistant resin fine particles which is a polyimide resin, a polyamide- imide resin or a polyamide resin having <=40mum average particle diameter are blended with (C) a solvent. In the prepared paste, the fine particles exist as a heterogeneous phase against a homogenous phase consisting of the polyimide precursor and the solvent before heating and curing, and the polyimide precursor and the fine particles exist as a homogenous phase after heating and curing.</p>
申请公布号 JP2987950(B2) 申请公布日期 1999.12.06
申请号 JP19910007990 申请日期 1991.01.25
申请人 HITACHI KASEI KOGYO KK 发明人 NISHIZAWA HIROSHI;SUZUKI KENJI
分类号 C08L79/08;C09D179/08;H01L21/312;H01L23/29;H01L23/31;H05K3/28;H05K3/46;(IPC1-7):C08L79/08 主分类号 C08L79/08
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