发明名称 |
ENHANCED ADHESION FOR LIGA MICROFABRICATION BY USING A BUFFER LAYER |
摘要 |
The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized from pyromellitic anhydride and oxydianiline (PMDA-ODA).
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申请公布号 |
WO9961954(A1) |
申请公布日期 |
1999.12.02 |
申请号 |
WO1999US10454 |
申请日期 |
1999.05.21 |
申请人 |
UNITED STATES DEPARTMENT OF ENERGY |
发明人 |
BAJIKAR, SATEESH, S.;DE CARLO, FRANCESCO;SONG, JOSHUA, JAI-HO |
分类号 |
G03F7/00;G03F7/085;(IPC1-7):G03C1/72;G03C5/00 |
主分类号 |
G03F7/00 |
代理机构 |
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