| 摘要 |
<p>The invention concerns a method for producing a group of openings mutually positioned with accuracy on a structure and comprising, for example, a first opening produced in a first layer and a second opening produced in a second layer covering the first layer, the first opening being located inside the second opening. The method consists in: depositing on the first layer (41) a light-sensitive resin layer; etching said resin by photolithography, using a single mask, to leave on the first layer (41) a resin island (42) per group of openings, the resin island outer limit corresponding to the second opening, the resin island comprising an opening (43) corresponding to the first opening; vacuum depositing, on the first layer (41) and the remaining resin, a material (44) designed to constitute the second layer, said deposit being produced under a projection such that the first layer part (45) located at the resin island (42) opening (43) bottom is not covered by said deposit; etching the first layer (41) starting from the island (42) opening (43) to obtain the first opening (46) in the first layer; eliminating the remaining resin and the material covering it to obtain the second opening in the second layer.</p> |
