| 摘要 |
<p>A method and apparatus for increasing wafer throughput between cleanings in a semiconductor processing reactor (20) includes a mechanism (58) for exchanging any one of or combination of an electrode (32), a dispersion head (42), and related chamber walls (22) and insulation and/or other collecting surfaces or elements with replacement components without having to open the reaction chamber (24) to atmospheric pressure and thus, while maintaining the reaction chamber (24) at about the operating pressure or vacuum.</p> |
