Producing adjustment structures in semiconducting substrates

摘要

The invention relates to a method of producing calibration structures in semiconductor substrates in the production of micromechanical systems with integrated semiconductor electronics. The inventive method comprises the following steps: structuring a first layer (3) on a first substrate (4, 5, 6) to produce first areas (2) which are required for the function of the components; producing second areas (1) in the first layer (3) which represent the calibration structures. The second areas (1) have a refractive index which differs from the refractive index of the adjacent areas. The method further comprises the step of joining the first substrate (4, 5, 6) with a second substrate (12) so that the first substrate (3) is embedded between said two substrates. Reducing the thickness of the first or second substrate to a remaining thickness. The substrate layer having said remaining thickness represents, for example, the membrane of a pressure sensor. The invention provides a means for preventing the mechanical properties of supporting layers from being weakened and allows integration into the production process without requiring additional process steps or extensive etching methods.