发明名称 METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENTS
摘要 <p>Method and apparatus for mounting electronic components in which components are efficiently fed and transferred for enhancing productivity is provided. Tray draw-out device (6) is disposed at a component feeding unit (4) for pulling out a tray (3) accommodating electronic components (2) from the component feeding unit (4) to a given pick-up position, where the electronic components (2) are transferred by the transfer mechanism (11) on to a temporary holder (8) disposed on a draw-out arm (7) of the tray draw-out device (6). Mounting head (5) has a plurality of mounting nozzles (5a), with which the mounting head (5) picks up several electronic components (2) aligned on the temporary holder (8) at a time and mount them on to a circuit board (1) which has been loaded and located at a prescribed position.</p>
申请公布号 EP0960555(A1) 申请公布日期 1999.12.01
申请号 EP19980902256 申请日期 1998.02.16
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KITAMURA, NAOYUKI;OKUDA, OSAMU;KABESHITA, A.;TAKEDA,TAKESHI
分类号 H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K13/04
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