发明名称 Device for making wire connections to semiconductor chips
摘要 <p>The apparatus includes a contacting element (10) carrying a capillary tube (12) with a connector wire (3'). A carrier unit (30) holds the contacting element and is movable parallel to the chip surface, and a flexible link structure (G) joins the contacting element with the carrier unit. The link structure includes a pair of flexurally elastic laminas (22) arranged symmetrically about a plane (S), and results in a pivot axis (A2) which is oriented parallel to the chip surface and is located outside the link structure. The two converging laminas, together with stiff elements (23,24) joining them, form a single trapezium-shaped frame (20). The stiff elements are respectively joined to the carrier unit and the contacting element.</p>
申请公布号 EP0802012(B1) 申请公布日期 1999.12.01
申请号 EP19970105755 申请日期 1997.04.08
申请人 ESEC SA 发明人 PASQUIER, LAURENT
分类号 H01L21/60;B23K20/00;(IPC1-7):B23K20/00 主分类号 H01L21/60
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