| 摘要 |
A wafer polishing apparatus (101) includes a rotatably supported polishing table (102), a pad (107), a carrier head (103), and a backing pad (115). The pad (107) is fixed to the polishing table (102). The carrier head (103) is arranged to oppose the polishing table (102) and is supported to be rotatable and movable forward/backward with respect to the polishing table (102). The backing pad (115) is fixed to a surface of the carrier head (103) which opposes the polishing pad (107), and presses a wafer (116) against the polishing pad (107) by cooperation with compressed air. The backing pad (115) is constituted by an annular foamed body (152) having closed cells to press an outer peripheral portion of the wafer (116), and a columnar second foamed body (151) having open cells and provided inside the first foamed body (152). <IMAGE> |
