| 摘要 |
PROBLEM TO BE SOLVED: To enable stress caused by a temperature change in a solder layer to be lessened by openings provided to the troughs of corrugations of a corrugated strip, by a method wherein the openings are provided to the troughs of corrugations of the corrugated strip which are soldered to a mounting plate that bears up electrical component elements that release heat. SOLUTION: As openings 2 are provided to a corrugated strip 1 along the axes of troughs 3 of corrugations of the strip 1, the troughs 3 of corrugations of the strip 1 are connected to a mounting plate 7 by spot soldering. By this setup, soldered joints are markedly lessened in rigidity, and stress caused by a temperature change can be reduced to a non-critical region. The corrugated strip 1 is high enough in bending flexibility in the direction vertical to the wave axis, so that a heavy stress is hardly imposed in the direction vertical to the corrugation axis after the mounting plate 7 and the strip 1 are soldered together. Therefore, the openings 2 provided to the troughs of corrugations of the corrugated strip 1 are capable of reducing stress caused by a temperature change in a solder layer. |
