| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed board, wherein high frequency noises can be reduced with a simple structure and the packing density can be enhanced. SOLUTION: A power source pattern 1 and ground pattern (ground face, layer) 3 are formed on one surface and the other surface of a board 2, respectively, a dielectric 4 coming into contact with the power source pattern 1 and ground pattern 3 is embedded in the board 2, the power source pattern 1, dielectric 4 and ground pattern 3 form a capacitor with which high frequency noise superposed on the power source pattern 2 can be attenuated.</p> |
