摘要 |
PROBLEM TO BE SOLVED: To simultaneously move a plurality of electronic components downward by providing a component take-in member at the bottom of a part storage container in a bulk shape and taking in the storage parts with a plurality of mounting holes, where the upper end opening is formed toward the inside of the storage container in a predetermined direction and moving them due to dead weight. SOLUTION: The outer end of a slope 3c of a mounting member 3 nearly coincides with the bottom surface of a sculptured surface recessed part 2a, and one portion of chip parts P which are stored in a storage room 2a enters into the inside of the sculptured surface recessed part 2a2. In the rising process of the mounting member 3 from an initial position, the chip parts P in the curved surface recessed part 2a2 are released due to the thrust-up of the mounting member 3 and are taken into the upper opening of each mounting hole 3b, in the longitudinal direction by utilizing the inclination of the slope 3c. Then, the chip parts P are simultaneously and successively taken in. The chip parts P that have been taken in move downward in the mounting hole 3b due to the dead weight, and transfer pipes 4 communicating with the lower end of each mounting hole 3b successively enter into them. The chip parts P further moves downward due to the dead weight, the posture is changed from being side directed to vertical directed by approximately 90 degrees in the traveling process, and the chip parts move to the lower end of each transfer pipe. |