| 发明名称 |
Method and apparatus for improved semiconductor wafer polishing |
| 摘要 |
In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.
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| 申请公布号 |
US5993293(A) |
申请公布日期 |
1999.11.30 |
| 申请号 |
US19980098774 |
申请日期 |
1998.06.17 |
| 申请人 |
SPEEDRAM CORPORATION |
发明人 |
CESNA, JOSEPH V.;KIM, INKI |
| 分类号 |
B24B37/04;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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