| 摘要 |
PROBLEM TO BE SOLVED: To obtain a capillary and a bump forming method, capable of securing a high connection characteristic and reliability between a ball and an electronic pad, even when the area of the electrode pad is reduced. SOLUTION: A ball 16 is depressed to an electrode pad 10 by using a capillary 12, of which bottom forms a taper shape conically recessed from a circumferential edge part to a hole on a center part and exciting the ball 16 by an ultrasonic wave to form a wire bump 18. Since the transmission of energy and the distribution of plastic deformation are regulated through the taper shape of the bottom of the capillary 12 and concentrated into the center part of the pad 10, an annular junction area 20 between the bump 18 and the pad 10 can be stored in the pad 10, even when the area of the pad 10 is smaller than a conventional case. As a result, a substantial junction area can be sufficiently secured, junction strength can be improved and a high connection characteristic and reliability can be obtained. |
