| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method which can be applied with automatic soldering connection and can manufacture IC cards of good quality in high yield. SOLUTION: This manufacturing method includes a lead wire connecting process wherein lead wires 5 and 5' and a terminal 8 are connected after an IC chip 3 and an antenna coil 2 are positioned on a thin plate type jig 4 and the lead wires 5 and 5' are fixed by being guided creeping over terminals of the IC chip 3 when the IC chip 3 and antenna coil 2 are embedded in an IC card main body after the IC chip 3 is connected by the lead wires 5 and 5' of the antenna coil 2. In the lead wire connecting process, a torsion coil spring 6 having a spring coil part and bent leg parts atop of arm parts extending from both ends of the spring coil part is used as a means for fixation connection and the lead wires 5 and 5' are fixed by being energized to a wall part 7 formed on the jig 4 with the spring repulsing force of the leg parts. |
