| 摘要 |
PROBLEM TO BE SOLVED: To provide cerium oxide abrasives, suitable for grinding the insulating film layer of organic SOG film or organic polymer film, with which global planarization is enabled, the property of fine embedding between wires is made satisfactory and a permittivity is low, and a producing method for substrate to use the cerium oxide abrasives. SOLUTION: An insulating film layer of organic SOG film or organic polymer film provided on a substrate is ground with the cerium oxide abrasives distributing cerium oxide particles in water, with which primary particles having a primary particle diameter smaller than 10 nm occupy more than 90% of the total, and secondary particles having a secondary particle diameter coagulating the primary particles smaller than 1μm, occupy more than 90% in all. With these abrasives, the insulating film layer of organic SOG film and organic polymer resin film can be ground at a high speed without being damaged. With this producing method for substrate, since steps in each layer is hardly generated over the entire surface of the substrate, making wiring microscopic can be sufficiently dealt with and multilayer wiring based on high density and high integration is enabled.
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