发明名称 CONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition having excellent forming property and conductivity by using zinc-based metal powder carrying conductivity as a main component, and including a low melting point metal and synthetic resin in the zinc-based metal powder. SOLUTION: This conductive resin composition is composed of zinc group- based powder, a low melting point metal melted when molded, and a synthetic resin. As the zinc-based metal powder, metal zinc powder, brass powder and tin-zinc powder can be used. The zinc-based metal powder having 1-100μm of grain size is desirably used, and the zinc-based metal powder is desirably blended at 10-60 vol.% in relation to the whole of the conductive resin composition at 100 vol.%. As the low melting point metal, tin or a tin alloy known as the solder can be used, and formed into fine powder so as to be blended with the resin. The low melting point metal is blended at 15 vol.% or less in relation to the whole of the composition. As the synthetic resin material, the thermoplastic resin can be used, and desirably blended at 30-80 vol.% in relation to the whole of the composition. As other component, metal fiber, metal powder except for the zinc-based, and the extender such as calcium carbonate and talc can be blended.
申请公布号 JPH11329074(A) 申请公布日期 1999.11.30
申请号 JP19990063606 申请日期 1999.03.10
申请人 TOGO SEISAKUSYO CORP 发明人 SAKAKIBARA KAZUTOSHI;NAKAJIMA TAKASHI;KANEKO MINORU;HARADA MASATOSHI
分类号 H01B1/22;C08K3/08;C08K7/02;C08L101/00;C09D5/24;H01B1/00;(IPC1-7):H01B1/22 主分类号 H01B1/22
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