| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor product which is excellent in degree of integration and forms a short signal transmission route, by a method wherein semiconductor chips are mounted upright on a printed circuit board, the semiconductor chips are connected to the board with a conductive connecting member, and outer connection terminal solder balls connected to the semiconductor chip are formed on the rear surface of the board. SOLUTION: U-shaped grooves 6 are provided to a printed circuit board 1, and semiconductor chips 2 are mounted upright on the board 1. The bonding pads 11 of the semiconductor chips 2 are ball-bonded to pads 12 provided to the printed circuit board 1 with conductive gold balls 3. After the semiconductor chips 2 and the ball-bonded parts are sealed up, solder balls 5 are mounted on the underside of the board 1. The chips 2 are integrally mounted upright in a vertical direction on the printed circuit board 1, so that a semiconductor product of this constitution is excellent in degree of integration, and as the semiconductor chips 2 are electrically connected to the solder balls 5 provided to the underside of the board 1, a signal route can be shortened. |
