| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a low-cost IC available for two kinds of audio signal processing circuits, with and without a compensation circuit. SOLUTION: A manufacturing method includes a step for preparing a chip 8, in which a circuit with an audio processing path through a transfer function f(x) and an audio processing path, bypassing the transfer function f(x) is formed in a monolithic method. These audio processing paths are selected by a selective switch and jointed to an output. At the same time, electrode pads 6 and 7 are formed at each input end. The manufacturing method includes a step for preparing a first lead frame with two inner leads, corresponding to the electrode pads 6 and 7 and a second lead frame with one inner lead 13. When a compensating circuit is necessary, the chip 8 is mounted on the first lead frame, and a step for wire-bonding the electrode pads 6 and 7 with each corresponding inner lead is selected. When the compensation circuit is not necessary, the chip 8 is mounted on the second lead frame and a step for wire-bonding the electrode pads 6 and 7 to one inner lead is selected.</p> |
