| 摘要 |
PROBLEM TO BE SOLVED: To detect the inclination of an image data of a semiconductor wafer image picked-up at an arbitrary angle. SOLUTION: Image data are edge-processed (22), and binarized (23), and the image data are Hough transformed (24) so that a parameter chart can be generated. Coordinates at which a large number of the overlap of Hough curves is generated are extracted from the parameter chart (25), and grouped, and representative coordinates are selected for each group (27) so that the inclination of image data can be estimated. Thus, linear components can be recognized from the image data, and the inclination of the linear components can be estimated. |
