| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having a multilayered structure and provided with connection pads for interlayer connection by which the increase of the contact resistance of a contact plug can be prevented by preventing the etching of the contact plug due to misalignment in a lithography process. SOLUTION: After contact holes are formed by etching an interlayer insulating film 107 by using an insulating film 108 for separating connection pad and first conductive films 111 (sidewalls) as a mask and a second conductive film 113 is formed on the entire surface of the insulating film 107 so as to fill up the contact holes, connection pads 114 are formed by partially removing the second conductive film 113 through CMP. |
