| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor chip on a supporting base plate without a restriction by eliminating the need for further shortening a bonding wire, when the semiconductor chip is mounted on the supporting base plate in a semiconductor device. SOLUTION: A semiconductor device has a supporting base plate 12, a semiconductor chip 14 mounted on the supporting base plate 12, a bonding wire 16 for connecting the semiconductor chip 14 and the supporting base plate 12, and a molding resin 18. The supporting base plate 12 has a dummy bonding area 22a which is not necessary for electrical operation, while the semiconductor chip 14 has a dummy bonding pad 20a which is not necessary for electrical operation. One end of at least one dummy bonding wire 16a is connected to the dummy bonding area. The other end of the dummy bonding wire 16a is connected to the dummy bonding pad 20a. |
