MANUFACTURE OF SEMICONDUCTOR DEVICE AND TRANSFER MOLD DEVICE THEREOF

摘要

PROBLEM TO BE SOLVED: To suppress the occurrence of package cracks due to gate part curing resin which is left in an encapsulated body. SOLUTION: This transfer mold device is constituted of injecting melted resin from a gate 20 into a cavity 22 formed by a molding die consisting of upper and lower dies and then curing the injected resin. The device has a gate cutting mechanism for dividing the resin held at a liquid state, during curing or at a cured state by a gate cutting shutter 25 built in the molding die. The division of resin by the shutter 25 is constituted so as to divide the resin on a boundary part between the gate 20 and the cavity 22. Respective gate cutting shutters 25, corresponding to respective cavities 22 of the molding die are constituted so as to execute dividing operation by a single dividing mechanism. The cavity 22 of the molding die constitutes a cavity for forming a resin encapsulated type semiconductor device.