| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for producing a printed wiring board equipped with a dust collector for removing resin powder adhering to the surface efficiently without causing damage to a resin applied copper foil. SOLUTION: A dust collector comprises a surface plate 1 having upper surface for mounting a resin applied copper foil having upper surface arranged specifically with a plurality of through holes 2, immediately before lamination, such that the copper foil surface covers the through holes 2, and a suction means for removing foreign matter adhering to the copper foil surface of the resin applied copper foil 3 mounted on the upper surface from the through hole. |
