| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a ceramic circuit board to be enhanced in bonding strength, heat cycle-resistant properties, and flexual strength (bending strength), by a method wherein the ceramic circuit board is warped like a concave form to a metal circuit board, and the warpage of ceramic circuit board is specified in amount. SOLUTION: A ceramic circuit board 1 is warped like a concave form to a metal circuit board 3, and the warpage D of the circuit board 1 is controlled to be 100μm or less. The ceramic circuit board 1 is warped as prescribed through a method where the metal circuit board 3 and a ceramic board 2 are previously bonded together into the ceramic circuit board 1, and a load is forcibly applied to the ceramic circuit board, whereby the ceramic circuit board 1 is warped into a concave form to the metal circuit board 3. The ceramic circuit board 1 where the warpage D is adjusted as prescribed has a structure where the metal circuit board 3 is integrally bonded to the concave surface of the curved ceramic board 2, and a back metal plate 4 is integrally bonded to the rear surface (convex surface) of the ceramic board 2.</p> |
