| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent peeling-off and damage, caused by contact, of conductive plating applied to a bus bar at the time of overlapping plurality of members for a circuit to make a circuit body. SOLUTION: Holding parts 14 and 15 hold a plurality of bus bars 13 parallel to each other leaving an interval to form a plurality of members 11 and 12 for a circuit. One member 11 for the circuit is made to slide along the other member 12 for the circuit to be superposed on the other member 12, and, in the overlapped state, they are fixed by a resin mold. An adjustment part 21, which preferentially comes into contact with the other member 12 for the circuit to make a connecting part 20 of the bus bars 13 in the one member 11 for the circuit levitate from the other member 12 for the circuit, is installed on the one member 11 for the circuit.</p> |
