Planarization composition for removing metal films

摘要

A planarization composition is set forth in accordance with an embodiment of the invention. The composition comprises spherical silica particles having a weight average particle diameter which falls within the range from about 0.03 mu to about 2 mu and is mono-disperse in that at least about 90 weight percent of the particles have a variation in particle diameter from the average particle diameter of no more than about +/-20%. A liquid carrier comprising up to 20 weight percent ROH, and an amine hydroxide which is NR4OH or NR2NR3OH, where each R is HCH3, CH2CH3, C3H7 or C4H9, in the amount of 0.1 to 10 weight percent; an oxidizer which is in the amount from about 0.5% to 15% weight percent; an acid stabilizer for adjusting the pH to fall within a range from about 7.0 to about 0.5; and the remainder is water. The invention also relates to a thinning, polishing and planarizing apparatus and to a method for carrying out the thinning, polishing and planarizing operation.