Semiconductor fabrication employing a spacer metallization technique

摘要

An integrated circuit fabrication process is provided in which an interconnect having a least one vertical sidewall surface is formed. The interconnect thusly formed allows for higher packing density within the ensuring integrated circuit since the interconnect requires less space to accommodate the same current density as an interconnect having sloped (i.e., non-vertical) sidewall surfaces. A semiconductor topography is provided which includes transistors arranged upon and within a silicon-based substrate. A first interlevel dielectric is deposited across the semiconductor topography, and portions of the dielectric are removed to form vias to select portions of the transistors. Conductive plugs are formed exclusively within the vias. An insulating material patterned with vertical sidewall surfaces is then formed across the first interlevel dielectric and a portion of the plugs. The insulating material is then patterned. Conductive material is then deposited across the patterned insulating material, the plug upper surfaces, and the first interlevel dielectric. A portion of the conductive material is anisotropically removed to form interconnects which are laterally adjacent to the sidewall surfaces of the insulating material. Each interconnect includes two surfaces, one of which is vertical to the underlying topography and the other of which extends a distance from the fist surface and links with an upper region of the surface in an arcuate pattern. The first lateral surface of the interconnect is directly adjacent to a sidewall surface of the insulating material and is therefore intended to be vertical. The second lateral surface extends a distance from the first lateral surface, constrained the limitations of deposition and not lithography.