| 摘要 |
The manufacturing method involves having several separate conductive tracks (8) in a printed circuit arrangement and a dielectric film (1). This is coated with a top surface conductive layer. which is subsequently mechanically machined using a sharp cutting bit. This enables the removal of slots between the conductive tracks, to separate the tracks. This is achieved without shrinkage of the desired conductive material, and without reduction of the conductive depth. There is a conductive arrangement located on the tracks for connection to electronic components, and a protective layer is located on the printed circuit. |
