| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized solid-state image pickup device which can be cooled highly efficiently. SOLUTION: A solid-state image pickup device is provided with a heat dissipating plate 10 having an I/O pin leading-out hole 10a, a Peltier element 12 mounted on the plate 10 in such a state that its heat dissipating surface 12a is brought into contact with the plate 10; a solid-state image pickup element 14 arranged on the heat endothermic surface of the element 12; a wiring board 16 which is mounted on the I/O pin leading-out section 10a of the plate 10, is electrically connected to the element 14, and leads out I/O pins 16a from the section 10a; and a lead wire 20 for supplying the driving current of the Peltier element 12. |
