| 摘要 |
PROBLEM TO BE SOLVED: To ensure reliability of connection of a viahole and a wiring pattern by eliminating sulfide and carbide, in a method for eliminating sulfide and carbide deposited in the viahole connecting parts between wirings, regading a manufacturing method of a circuit board. SOLUTION: A manufacturing method of a circuit board in which photosensitive polyimide resin layer is used as an insulating layer between wiring patterns consists of a process for forming viaholes 6 connecting a wiring pattern 4 with a photosensitive polyimide resin layer 5, in the manufacturing method of a circuit board in which the photosensitive polyimide resin layer is used as the insulating layer between wiring patterns, and a process eliminating sulfide 7 and carbide 8 in the viahole. |
