发明名称 VAPORIZING COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a vaporizing cooling device which enables a pressure sensor to accurately measure the pressure in the device, even when the pressure sensor is attached to the external surface of the device. SOLUTION: A thin board 30 is provided as a thin wall section having a prescribed area to part of a pressure vessel composed of a closed container 15, in which a stack 17 having a heating element is dipped in a refrigerant 16 contained in the container 15; a gas-phase pipeline 22 through which a vaporized refrigerant generated, when the refrigerant 16 is boiled is discharged to the outside; a cooler 25 which liquefies the vaporized refrigerant discharged to the outside through the pipeline 22 by condensation; and a liquid-phase pipeline 28 through which the liquefied refrigerant is returned to the container 15. At the same time, a pressure sensor is attached to the external surface of the thin board 30.
申请公布号 JPH11330330(A) 申请公布日期 1999.11.30
申请号 JP19980135454 申请日期 1998.05.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA TAMOTSU
分类号 H05K7/20;H01L23/427;H01L23/44;(IPC1-7):H01L23/44 主分类号 H05K7/20
代理机构 代理人
主权项
地址