| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a manufacturing operation to be carried out keeping laminated diodes of high-withstand voltage in a state where they are very accurately arranged, by a method wherein the diodes are each pinched between the lead wires of a lead frame taking advantage of the elasticity of the lead wires, and then the lead wires are soldered to the diode by heating. SOLUTION: A lead frame 7 is possessed of a large number of lead wires 7-1 which are provided like the teeth of a comb. A space between the lead wires 7-1 is widened, a laminated diode 1 of high-withstand voltage is inserted between a pair of the lead wires 7-1, and, when the widened space between the lead wires 7-1 is returned to the original space, the lead wires are restored to the original due to elasticity, and the laminated diode 1 of high-withstand voltage is pinched between a pair of the lead wires 7-1 by the elasticity of the read wires. In this state, when the diodes 1 and the lead wires 7-1 are increased up to a soldering temperature, the ends of the diode chip 1 and the tips of a pair of the lead wires 7-1 are soldered together and fixed. Therefore, a soldering operation can be carried out keeping diodes in a state where they are accurately arranged.</p> |
