发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus, which is able to adjust parallelism between a tool and a stage required at the pressing mounting of COG(chip-on-glass) or TCP(tape carrier package) in a short time, to evaluate it quantitatively, and also to provide a method therefor. SOLUTION: This apparatus includes tools 35 which are disposed under lower ends of mounting heads 30 for pushing electronic components, a tilt adjusting mechanism positioned at a position higher than the tools for adjusting front, back, right and left tilts of the tools, a transparent stage 181 for carrying thereon an object on which the electronic parts are to be mounted, an illuminating device 90 for illuminating light on an object-carrying surface of the stage, and an image-pickup device 30 for detecting Newton interference fringes, based on light received from the illuminating device with the tools contacted with the object-carrying surface of the stage. Parallelism of the tools to the stage is adjusted by a tilt adjusting mechanism so that the Newton interference fringes are positioned equal in forwards, backwards, right and left directions with respect to a center of the tools, and then the electronic components are mounted on the object carried on the stage by means of the tools.
申请公布号 JPH11330156(A) 申请公布日期 1999.11.30
申请号 JP19980127711 申请日期 1998.05.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHIGEZAKI HIROHISA;NISHIDA KAZUTO;TSUJI SHINJIRO;HATA KANJI
分类号 H05K13/04;H01L21/60;H05K13/08 主分类号 H05K13/04
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