| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing adverse effects of impurity of a tape bonded on a surface of a chip, as in a lead-on-tape(LOC) structure and protecting a minute wiring like a fuse formed at an opening of an uppermost surface cover. SOLUTION: An adhesive layer 4 of a tape 3 bonded to a chip surface is arranged, in such a way that the adhesive layer 4 is not overlapped with an opening 10a of cover 10 at a surface of a semiconductor element 2. The tape 3 is normally at a distant of 0.1 mm or more from the cover opening 10a at the surface of the semiconductor element 2. It two or more covers 10 are laminated, the tape 3 is a distance of 0.1 mm or more from the opening 10a at the uppermost surface of the semiconductor element 2. In addition, the opening 10a includes a fuse opening or includes a bonding pad and the fuse opening.</p> |
