| 摘要 |
PROBLEM TO BE SOLVED: To enable alignment of heights between electro-optical devices having rough surfaces, warpages or surface steps. SOLUTION: A solder layer 10 is formed by patterning on a first transfer carrier substrate 9 having a poor wetting property to solder (a), the solder layer 10 is positioned on a lower electrode 12 of an electro-optical device 11 (b), and then the solder is melted, thereby transferring the solder layer 10 onto the lower electrode 12 and forming solder bumps 13 (c). Further, a second transfer carrier substrate 16, having a solder layer 14 with a small pattern shape and having a solder layer 15 with a large pattern shape, is positioned with respect to the electro-optical device 11 having the bumps 13 formed thereon, and the solder is melted to thereby transfer the solder layers 14 and 15 again on the lower electrode 12, and to form solder bumps 17 and 18 having small and large shapes. |
