| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump forming method in which troubles such as damage of an electrode caused by discharge due to rapid temperature change, suction of wafer to a part on a heater, and break of a wafer caused by more rapid temperature change are eliminated, and productivity is remarkably improved, when bonding work is performed while the wafer is heated in order to form a bump on a pad formed on a wafer composed of piezoelectric material having pyroelectric effect. SOLUTION: This bump forming method for forming a bump on an electrode of a wafer 31 having pyroelectric effect consists of a step for heating previously a wafer mounted on a carrier 30 up to a specified upper limit temperature, outside a bonding area; a step for transferring the wafer whose temperature reaches the specified upper limit temperature to the inside of the bonding area, in the state that the wafer is mounted on the carrier 30; a step for transferring the wafer on which a bump is formed in the bonding area to the outside of the bonding area, in the state that the wafer is mounted on the carrier 30; and a step for cooling the wafer transferred to the outside of the bonding area. |
