| 摘要 |
PCT No. PCT/SE96/00834 Sec. 371 Date Dec. 23, 1997 Sec. 102(e) Date Dec. 23, 1997 PCT Filed Jun. 25, 1996 PCT Pub. No. WO97/01872 PCT Pub. Date Jan. 16, 1997A microwave circuit having a two-sided substrate on which a microwave lead-through is arranged in the form of a symmetrical lead-through structure, being provided by opposite metallizationless areas on the upperside and the underside of the substrate and comprising a lead-through conductor, coplanar width adaption segments and first and second line segments connected thereto, the ground of said segments comprising opposite metallization parts being inter-connected through via holes. In a sealed microwave circuit a seal lead-through comprises said lead-through structure and a microstrip line segment.
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