| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be made thin and have a strength sufficient to bending, twisting, etc., and can be used suitably as an IC card. SOLUTION: In the card type semiconductor device, a copper wiring layer 2 and an inner lead 3 are provided on one surface of an insulating resin wiring film 1, a semiconductor chip 4 which is thinner (30-70 μm in thickness) than the film 1 is embedded in a device hole of the film so that an electrode terminal of the chip is jointed to the inner lead 3. A resin encapsulating layer is formed as necessary outside the joint part, polyester resin films 5 are formed integrally as laminated on upper and lower sides of the wiring film as outer encapsulating layers. |
