发明名称 Silicon carbide fabrication
摘要 An SiC film having an excellent strength and thermal characteristics. The SiC film is prepared by a CVD process (i.e. CVD-SiC fabrication) and has a thermal conductivity along the direction of the SiC crystal growth between 100 and 300 W/mxK, and an average grain diameter of the internal structure between 4 to 12 mu m. It is preferred that the ratio of the thermal conductivity along the direction of the SiC crystal growth to the thermal conductivity in the perpendicular direction is in a range of 1.10 to 1.40.
申请公布号 US5993770(A) 申请公布日期 1999.11.30
申请号 US19980140828 申请日期 1998.08.26
申请人 TOKAI CARBON COMPANY, LTD. 发明人 KUROYANAGI, AKIHIRO;YASUNAKA, TOMIYA;USHIJIMA, YUJI;KANAI, KENICHI
分类号 C04B35/565;B28B1/30;C01B31/36;C23C16/32;C23C16/42;H01L21/683;(IPC1-7):C01B31/36;B01J27/22;B01J27/224;C30B13/00 主分类号 C04B35/565
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