发明名称 |
Silicon carbide fabrication |
摘要 |
An SiC film having an excellent strength and thermal characteristics. The SiC film is prepared by a CVD process (i.e. CVD-SiC fabrication) and has a thermal conductivity along the direction of the SiC crystal growth between 100 and 300 W/mxK, and an average grain diameter of the internal structure between 4 to 12 mu m. It is preferred that the ratio of the thermal conductivity along the direction of the SiC crystal growth to the thermal conductivity in the perpendicular direction is in a range of 1.10 to 1.40.
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申请公布号 |
US5993770(A) |
申请公布日期 |
1999.11.30 |
申请号 |
US19980140828 |
申请日期 |
1998.08.26 |
申请人 |
TOKAI CARBON COMPANY, LTD. |
发明人 |
KUROYANAGI, AKIHIRO;YASUNAKA, TOMIYA;USHIJIMA, YUJI;KANAI, KENICHI |
分类号 |
C04B35/565;B28B1/30;C01B31/36;C23C16/32;C23C16/42;H01L21/683;(IPC1-7):C01B31/36;B01J27/22;B01J27/224;C30B13/00 |
主分类号 |
C04B35/565 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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