| 摘要 |
In a resist deposition machine, an edge rinse mechanism comprising a cover covering and surrounding an exfoliating-agent discharging nozzle and having an opening formed at a position in the proximity of a peripheral edge portion of a wafer held on a vacuum chuck, and a forced-exhausting tube coupled to the cover. In an edge rinsing operation, the peripheral edge portion of the wafer is accommodated through the opening into an inside of the cover, and a resist exfoliating agent is discharged from the exfoliating-agent discharging nozzle to a peripheral portion of a resist film formed on the wafer held on the vacuum chuck, so that a dissolved resist material and the resist exfoliating agent are scattered into the inside of the cover, and forcibly exhausted from the cover through the forced-exhausting tube. Thus, it is possible to prevent the dissolved resist material and the resist exfoliating agent from adhering on a resist pattern formation zone of the resist film formed on the wafer.
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